The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Jan. 26, 2010
James N Humenik, Hopewell Junction, NY (US);
Sushumna Iruvanti, Hopewell Junction, NY (US);
Richard Langlois, Granby, CA;
Hsichang Liu, Hopewell Junction, NY (US);
Govindarajan Natarajan, Hopewell Junction, NY (US);
Kamal K Sikka, Hopewell Junction, NY (US);
Hilton T Toy, Hopewell Junction, NY (US);
Jiantao Zheng, Hopewell Junction, NY (US);
Gregg B Monjeau, Hopewell Junction, NY (US);
Mark Kapfhammer, Hopewell Junction, NY (US);
James N Humenik, Hopewell Junction, NY (US);
Sushumna Iruvanti, Hopewell Junction, NY (US);
Richard Langlois, Granby, CA;
Hsichang Liu, Hopewell Junction, NY (US);
Govindarajan Natarajan, Hopewell Junction, NY (US);
Kamal K Sikka, Hopewell Junction, NY (US);
Hilton T Toy, Hopewell Junction, NY (US);
Jiantao Zheng, Hopewell Junction, NY (US);
Gregg B Monjeau, Hopewell Junction, NY (US);
Mark Kapfhammer, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.