The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2012

Filed:

Mar. 17, 2006
Applicants:

Christian Dussarrat, Wilmington, DE (US);

Julien Gatineau, Ibaraki-ken, JP;

Kazutaka Yanagita, Tsukuba, JP;

Eri Tsukada, Tokyo, JP;

Ikuo Suzuki, Tsukuba, JP;

Inventors:

Christian Dussarrat, Wilmington, DE (US);

Julien Gatineau, Ibaraki-ken, JP;

Kazutaka Yanagita, Tsukuba, JP;

Eri Tsukada, Tokyo, JP;

Ikuo Suzuki, Tsukuba, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/40 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a silicon oxide film, comprising the steps of: —providing a treatment substrate within a reaction chamber; —purging the gas within the reaction chamber by feeding an inert gas into the chamber under reduced pressure at a substrate temperature of 50 to 400 C, —adsorbing, at the same temperatures and under reduced pressure, a silicon compound on the treatment substrate by pulsewise introduction of a gaseous silicon compound into the reaction chamber, —purging, at the same temperatures and under reduced pressure, the unadsorbed silicon compound in the reaction chamber with an inert gas, —at the same temperatures and under reduced pressure, introducing a pulse of ozone-containing mixed gas into the reaction chamber and producing silicon oxide by an oxidation reaction with the silicon compound adsorbed on the treatment substrate; and—repeating steps 1) to 4) if necessary to obtain the desired thickness on the substrate.

Published as:
WO2006097525A2; JP2006261434A; WO2006097525A3; TW200707582A; KR20070114393A; EP1861519A2; CN101171366A; JP2008533731A; US2009232985A1; KR20090107090A; KR100961805B1; EP1861519B1; ATE482301T1; DE602006017042D1; KR20120044992A; US8227032B2; US2012276292A1; KR20130027573A; KR101248358B1; JP2013070077A; JP5329218B2; US8613976B2; TW201403715A; TWI435387B; KR20140069192A; JP5631958B2; KR20150047631A; KR101547093B1; TWI515794B;

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