The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Aug. 07, 2008
Shou-sung Chang, Stanford, CA (US);
Hung Chih Chen, Sunnyvale, CA (US);
Stan D Tsai, Fremont, CA (US);
Yuchun Wang, Santa Clara, CA (US);
Shou-Sung Chang, Stanford, CA (US);
Hung Chih Chen, Sunnyvale, CA (US);
Stan D Tsai, Fremont, CA (US);
Yuchun Wang, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.