The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2012

Filed:

Dec. 08, 2009
Applicants:

Vinay Prabhakar, Fremont, CA (US);

Bryan L. Buckalew, Tualatin, OR (US);

Kousik Ganesan, Tualatin, OR (US);

Shantinath Ghongadi, Wilsonville, OR (US);

Zhian He, Beaverton, OR (US);

Steven T. Mayer, Lake Oswego, OR (US);

Robert Rash, Portland, OR (US);

Jonathan D. Reid, Sherwood, OR (US);

Yuichi Takada, Tualatin, OR (US);

James R. Zibrida, Portland, OR (US);

Inventors:

Vinay Prabhakar, Fremont, CA (US);

Bryan L. Buckalew, Tualatin, OR (US);

Kousik Ganesan, Tualatin, OR (US);

Shantinath Ghongadi, Wilsonville, OR (US);

Zhian He, Beaverton, OR (US);

Steven T. Mayer, Lake Oswego, OR (US);

Robert Rash, Portland, OR (US);

Jonathan D. Reid, Sherwood, OR (US);

Yuichi Takada, Tualatin, OR (US);

James R. Zibrida, Portland, OR (US);

Assignee:

Novellus Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25B 9/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.


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