The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Sep. 30, 2009
Frank M. Cerio, Jr., Albany, NY (US);
Shigeru Mizuno, Delmar, NY (US);
Jonathan Reid, Sherwood, OR (US);
Thomas Ponnuswamy, Sherwood, OR (US);
Frank M. Cerio, Jr., Albany, NY (US);
Shigeru Mizuno, Delmar, NY (US);
Jonathan Reid, Sherwood, OR (US);
Thomas Ponnuswamy, Sherwood, OR (US);
Tokyo Electron Limited, Tokyo, JP;
Novellus Systems, Inc., San Jose, CA (US);
Abstract
Methods are provided for multi-step Cu metal plating on a continuous Ru metal film in recessed features found in advanced integrated circuits. The use of a continuous Ru metal film prevents formation of undesirable micro-voids during Cu metal filling of high-aspect-ratio recessed features, such as trenches and vias, and enables formation of large Cu metal grains that include a continuous Cu metal layer plated onto the continuous Ru metal film. The large Cu grains lower the electrical resistivity of the Cu filled recessed features and increase the reliability of the integrated circuit.