The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2011

Filed:

Dec. 19, 2008
Applicants:

Ming-kuei (Michael) Tseng, San Jose, CA (US);

Norman Tam, San Jose, CA (US);

Yoshitaka Yokota, San Jose, CA (US);

Agus Tjandra, San Jose, CA (US);

Robert Navasca, Redwood City, CA (US);

Mehran Behdjat, San Jose, CA (US);

Sundar Ramamurthy, Fremont, CA (US);

Kedarnath Sangam, Sunnyvale, CA (US);

Alexander N. Lerner, San Jose, CA (US);

Inventors:

Ming-Kuei (Michael) Tseng, San Jose, CA (US);

Norman Tam, San Jose, CA (US);

Yoshitaka Yokota, San Jose, CA (US);

Agus Tjandra, San Jose, CA (US);

Robert Navasca, Redwood City, CA (US);

Mehran Behdjat, San Jose, CA (US);

Sundar Ramamurthy, Fremont, CA (US);

Kedarnath Sangam, Sunnyvale, CA (US);

Alexander N. Lerner, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.


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