The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Dec. 18, 2007
Ching-chung Su, Yongkang, TW;
Yi-wei Chiu, Kaohsiung, TW;
Tzu Chan Weng, Kaohsiung, TW;
Yih Song Chiu, Hsin-Chu, TW;
Pin Chia Su, Tainan County, TW;
Chih-cherng Jeng, Hsin-Chu, TW;
Kuo-hsiu Wei, Tainan, TW;
Ching-Chung Su, Yongkang, TW;
Yi-Wei Chiu, Kaohsiung, TW;
Tzu Chan Weng, Kaohsiung, TW;
Yih Song Chiu, Hsin-Chu, TW;
Pin Chia Su, Tainan County, TW;
Chih-Cherng Jeng, Hsin-Chu, TW;
Kuo-Hsiu Wei, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared.