The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Mar. 14, 2007
Hidetoshi Morokuma, Hitachinaka, JP;
Takumichi Sutani, Hitachinaka, JP;
Ryoichi Matsuoka, Hitachinaka, JP;
Hitoshi Komuro, Hitachinaka, JP;
Akiyuki Sugiyama, Hitachinaka, JP;
Hidetoshi Morokuma, Hitachinaka, JP;
Takumichi Sutani, Hitachinaka, JP;
Ryoichi Matsuoka, Hitachinaka, JP;
Hitoshi Komuro, Hitachinaka, JP;
Akiyuki Sugiyama, Hitachinaka, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
A workpiece size measurement method suitable for length measurement of multilayered circuit elements with increased complexities is disclosed. This method employs a technique for changing measurement conditions in a way pursuant to either an image of workpiece or the situation of a target semiconductor circuit element to be measured when measuring pattern sizes on the workpiece image using design data of the semiconductor circuit element. With such an arrangement, adequate measurement conditions are selectable in accordance with the state of workpiece image and/or the state of a circuit element formed on the workpiece, thereby making it possible to improve the measurement efficiency. A workpiece size measurement apparatus using the technique is also disclosed.