The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Apr. 06, 2007
Zsolt Nenyei, Blaustein, DE;
Paul J. Timans, Mountain View, CA (US);
Wilfried Lerch, Dornstadt, DE;
Jüergen Niess, Sontheim, DE;
Manfred Falter, Ulm, DE;
Patrick Schmid, Donzdorf, DE;
Conor Patrick O'carroll, Vancouver BC, CA;
Rudy Cardema, San Jose, CA (US);
Igor Fidelman, Danville, CA (US);
Sing-pin Tay, Fremont, CA (US);
Yao Zhi HU, San Jose, CA (US);
Daniel J. Devine, Los Gatos, CA (US);
Zsolt Nenyei, Blaustein, DE;
Paul J. Timans, Mountain View, CA (US);
Wilfried Lerch, Dornstadt, DE;
Jüergen Niess, Sontheim, DE;
Manfred Falter, Ulm, DE;
Patrick Schmid, Donzdorf, DE;
Conor Patrick O'Carroll, Vancouver BC, CA;
Rudy Cardema, San Jose, CA (US);
Igor Fidelman, Danville, CA (US);
Sing-Pin Tay, Fremont, CA (US);
Yao Zhi Hu, San Jose, CA (US);
Daniel J. Devine, Los Gatos, CA (US);
Mattson Technology, Inc., Fremont, CA (US);
Abstract
Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.