The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Aug. 31, 2005
Alan G. Wood, Boise, ID (US);
Warren M. Farnworth, Nampa, ID (US);
David R. Hembree, Boise, ID (US);
Sidney B. Rigg, Meridian, ID (US);
William M. Hiatt, Eagle, ID (US);
Peter Benson, Boise, ID (US);
Kyle K. Kirby, Boise, ID (US);
Salman Akram, Boise, ID (US);
Alan G. Wood, Boise, ID (US);
Warren M. Farnworth, Nampa, ID (US);
David R. Hembree, Boise, ID (US);
Sidney B. Rigg, Meridian, ID (US);
William M. Hiatt, Eagle, ID (US);
Peter Benson, Boise, ID (US);
Kyle K. Kirby, Boise, ID (US);
Salman Akram, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion that extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member that substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.