The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Apr. 22, 2008
Chien-hsiun Lee, Hsin-Chu, TW;
Chen-shien Chen, Zhubei, TW;
Mirng-ji Lii, Sinpu Township, Hsinchu County, TW;
Tjandra Winata Karta, Hsin-Chu County, TW;
Chien-Hsiun Lee, Hsin-Chu, TW;
Chen-Shien Chen, Zhubei, TW;
Mirng-Ji Lii, Sinpu Township, Hsinchu County, TW;
Tjandra Winata Karta, Hsin-Chu County, TW;
Taiwan Semconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A silicon-based wafer such as a TSV interposer wafer having a first and second surfaces wherein a glass carrier is mounted on the second surface by a UV tape is held by a vacuum holder applied on the first surface and the glass carrier is removed from the silicon-based wafer by irradiating the UV tape with a UV light through the glass carrier. The silicon-based wafer is then flipped and placed onto a vacuum plate and secured to the vacuum plate by applying vacuum to the vacuum plate. The vacuum holder is then released from the silicon-based wafer leaving the silicon-based wafer secured to the vacuum plate for subsequent processing steps.