The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Apr. 06, 2009
Kyle K. Kirby, Eagle, ID (US);
Salman Akram, Boise, ID (US);
David R. Hembree, Boise, ID (US);
Sidney B. Rigg, Meridian, ID (US);
Warren M. Farnworth, Nampa, ID (US);
William M. Hiatt, Eagle, ID (US);
Kyle K. Kirby, Eagle, ID (US);
Salman Akram, Boise, ID (US);
David R. Hembree, Boise, ID (US);
Sidney B. Rigg, Meridian, ID (US);
Warren M. Farnworth, Nampa, ID (US);
William M. Hiatt, Eagle, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.