The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2010
Filed:
Aug. 31, 2007
Soo-san Park, Seoul, KR;
Bumjoon Hong, Seoul, KR;
Sang-ho Lee, Kyounggi, KR;
Jong-woo Ha, Seoul, KR;
Soo-San Park, Seoul, KR;
BumJoon Hong, Seoul, KR;
Sang-Ho Lee, Kyounggi, KR;
Jong-Woo Ha, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.