The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Mar. 31, 2006
Kenji Sekiguchi, Nirasaki, JP;
Noritaka Uchida, Koshi, JP;
Satoru Tanaka, Koshi, JP;
Hiroki Ohno, Nirasaki, JP;
Kenji Sekiguchi, Nirasaki, JP;
Noritaka Uchida, Koshi, JP;
Satoru Tanaka, Koshi, JP;
Hiroki Ohno, Nirasaki, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A substrate (W) is processed with the use of a process liquid such as a deionized water. Then, a first fluid which is more volatile than the process liquid is supplied to an upper surface of the substrate (W) from a fluid nozzle () to form a liquid film. Next, a second fluid which is more volatile than the process liquid is supplied to the upper surface of the substrate (W) from the fluid nozzle (), while the wafer (W) is being rotated. During this supply operation, a supply position (Sf) of the second fluid to the substrate (W) is moved radially outward from a rotational center (Po) of the substrate (W). As a result, it is possible to prevent the generation of particles on the substrate (W) after it is dried by using the first and second fluids.