The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Apr. 05, 2005
Masaru Amai, Tokyo-To, JP;
Kenji Sekiguchi, Nirasaki, JP;
Takehiko Orii, Nirasaki, JP;
Hiroki Ohno, Nirasaki, JP;
Satoru Tanaka, Tosu, JP;
Takuya Mori, Tosu, JP;
Masaru Amai, Tokyo-To, JP;
Kenji Sekiguchi, Nirasaki, JP;
Takehiko Orii, Nirasaki, JP;
Hiroki Ohno, Nirasaki, JP;
Satoru Tanaka, Tosu, JP;
Takuya Mori, Tosu, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
In a substrate cleaning method and a substrate cleaning method according to the present invention, a brushis brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brushis moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzleonto the substrate W, and a cleaning position Sn of the two-fluid nozzleis moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brushfrom the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center Pthan the cleaning position Sb of the brush. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.