Substrate cleaning apparatus, substrate cleaning method, and medium for recording program used for the method

Abstract

In a substrate cleaning method and a substrate cleaning method according to the present invention, a brushis brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brushis moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzleonto the substrate W, and a cleaning position Sn of the two-fluid nozzleis moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brushfrom the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center Pthan the cleaning position Sb of the brush. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.