The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2010

Filed:

Oct. 17, 2005
Applicants:

Jason A. Ryder, Oakland, CA (US);

Ji Zhu, El Cerrito, CA (US);

Mark Wilcoxson, Oakland, CA (US);

Fritz Redeker, Fremont, CA (US);

John P. Parks, Hercules, CA (US);

Charles Ditmore, Oakland, CA (US);

Jeffrey G. Gasparitsch, Fremont, CA (US);

Inventors:

Jason A. Ryder, Oakland, CA (US);

Ji Zhu, El Cerrito, CA (US);

Mark Wilcoxson, Oakland, CA (US);

Fritz Redeker, Fremont, CA (US);

John P. Parks, Hercules, CA (US);

Charles Ditmore, Oakland, CA (US);

Jeffrey G. Gasparitsch, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus, system and method for cleaning a substrate edge include a composite applicator that cleans bevel polymers deposited on wafer edges using frictional contact in the presence of fluids. The composite applicator includes a support material and a plurality of abrasive particles distributed within and throughout the support material. The composite applicator cleans the edge of the wafer by allowing frictional contact of the plurality of abrasive particles with the edge of the wafer in the presence of fluids, such as liquid chemicals, to cut, rip and tear the bevel polymer from the edge of the wafer.


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