The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Sep. 15, 2005
Sun-pil Youn, Seoul, KR;
Chang-won Lee, Gyeonggi-do, KR;
Woong-hee Sohn, Gyeonggi-do, KR;
Gil-heyun Choi, Gyeonggi-do, KR;
Jong-ryeol Yoo, Gyeonggi-do, KR;
Dong-chan Lim, Seoul, KR;
Jae-hwa Park, Gyeonggi-do, KR;
Byung-hak Lee, Gyeonggi-do, KR;
Hee-sook Park, Seoul, KR;
Sun-Pil Youn, Seoul, KR;
Chang-Won Lee, Gyeonggi-do, KR;
Woong-Hee Sohn, Gyeonggi-do, KR;
Gil-Heyun Choi, Gyeonggi-do, KR;
Jong-Ryeol Yoo, Gyeonggi-do, KR;
Dong-Chan Lim, Seoul, KR;
Jae-Hwa Park, Gyeonggi-do, KR;
Byung-Hak Lee, Gyeonggi-do, KR;
Hee-Sook Park, Seoul, KR;
Abstract
A semiconductor device includes a first conductive layer on a semiconductor substrate, a dielectric layer including a high-k dielectric material on the first conductive layer, a second conductive layer including polysilicon doped with P-type impurities on the dielectric layer, and a third conductive layer including a metal on the second conductive layer. In some devices, a first gate structure is formed in a main cell region and includes a tunnel oxide layer, a floating gate, a first high-k dielectric layer, and a control gate. The control gate includes a layer of polysilicon doped with P-type impurities and a metal layer. A second gate structure is formed outside the main cell region and includes a tunnel oxide layer, a conductive layer, and a metal layer. A third gate structure is formed in a peripheral cell region and includes a tunnel oxide, a conductive layer, and a high-k dielectric layer having a width narrower than the conductive layer. Method embodiments are also disclosed.