The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Aug. 31, 2007
Applicants:
Jong-woo Ha, Seoul, KR;
Bumjoon Hong, Seoul, KR;
Sang-ho Lee, Kyounggi, KR;
Soo-san Park, Seoul, KR;
Inventors:
Jong-Woo Ha, Seoul, KR;
BumJoon Hong, Seoul, KR;
Sang-Ho Lee, Kyounggi, KR;
Soo-San Park, Seoul, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.