The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Nov. 06, 2003
Gareth Geoffrey Hougham, Ossining, NY (US);
Xiao HU Liu, Croton On Hudson, NY (US);
S. Jay Chey, Ossining, NY (US);
James Patrick Doyle, Bronx, NY (US);
Joseph Zinter, Jr., Brewster, NY (US);
Michael J. Rooks, Briarcliff Manor, NY (US);
Brian Richard Sundlof, Beacon, NY (US);
Jon Alfred Casey, Poughkeepsie, NY (US);
Gareth Geoffrey Hougham, Ossining, NY (US);
Xiao Hu Liu, Croton On Hudson, NY (US);
S. Jay Chey, Ossining, NY (US);
James Patrick Doyle, Bronx, NY (US);
Joseph Zinter, Jr., Brewster, NY (US);
Michael J. Rooks, Briarcliff Manor, NY (US);
Brian Richard Sundlof, Beacon, NY (US);
Jon Alfred Casey, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.