The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2009

Filed:

Mar. 21, 2005
Applicants:

Junhui OH, Inuyama, JP;

Atsunori Kawamura, Owariasahi, JP;

Tsuyoshi Matsuda, Kasugai, JP;

Tatsuhiko Hirano, Kakamigahara, JP;

Kenji Sakai, Nagoya, JP;

Katsunobu Hori, Iwakura, JP;

Inventors:

Junhui Oh, Inuyama, JP;

Atsunori Kawamura, Owariasahi, JP;

Tsuyoshi Matsuda, Kasugai, JP;

Tatsuhiko Hirano, Kakamigahara, JP;

Kenji Sakai, Nagoya, JP;

Katsunobu Hori, Iwakura, JP;

Assignee:

Fujima Incorporated, Aichi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing composition contains a deterioration inhibitor for inhibiting deterioration of polishing capability of the polishing composition, an abrasive, and water. The deterioration inhibitor is at least one selected from polysaccharide and polyvinyl alcohol. The polysaccharide is starch, amylopectin, glycogen, cellulose, pectin, hemicellulose, pullulan, or elsinan. Among them, pullulan is preferable. The abrasive is at least one selected from aluminum oxide and silicon dioxide, preferably at least one selected from fumed silica, fumed alumina, and colloidal silica. The polishing composition can be suitably used in polishing for forming wiring a semiconductor device.


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