The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
May. 10, 2006
Kai-ming Ching, Taichung, TW;
Chia-fu Lin, Hsin-Chu, TW;
Wen-hsiang Tseng, Hsinchu, TW;
Ta-min Lin, Hsinchu, TW;
Yen-ming Chen, Hsinchu, TW;
Hsin-hui Lee, Kaohsiung, TW;
Chao-yuan Su, Kaohsiung, TW;
Wen-hsiang Tseng, Hsinchu, TW;
Kai-Ming Ching, Taichung, TW;
Chia-Fu Lin, Hsin-Chu, TW;
Wen-Hsiang Tseng, Hsinchu, TW;
Ta-Min Lin, Hsinchu, TW;
Yen-Ming Chen, Hsinchu, TW;
Hsin-Hui Lee, Kaohsiung, TW;
Chao-Yuan Su, Kaohsiung, TW;
Wen-Hsiang Tseng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A new method is provided for the processing of metals, most notably copper, such that damage to exposed surfaces of these metals is prevented. During a step of semiconductor processing, which results in exposing a metal surface to a wet substance having a pH value, a voltage is applied to the metal that is exposed. The value of the applied voltage can, dependent on the value of the pH constant of the wet substance, be selected such that the exposed metal surface is protected against alkaline effects of the wet substance.