The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Jun. 30, 2006
Carl Deppisch, Chandler, AZ (US);
Tom Fitzgerald, Phoenix, AZ (US);
Fay Hua, Freemont, CA (US);
Wei Shi, Gilbert, AZ (US);
Mike Gasparek, Phoenix, AZ (US);
Carl Deppisch, Chandler, AZ (US);
Tom Fitzgerald, Phoenix, AZ (US);
Fay Hua, Freemont, CA (US);
Wei Shi, Gilbert, AZ (US);
Mike Gasparek, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component. A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.