Tom Fitzgerald

Title: The Innovations of Tom Fitzgerald

Introduction

Tom Fitzgerald is an accomplished inventor based in Phoenix, AZ. He has made significant contributions to the field of electronics, particularly in the development of advanced solder materials. With a total of 3 patents to his name, Fitzgerald's work has had a notable impact on the industry.

Latest Patents

One of Fitzgerald's latest patents is for a composite solder thermal interface material (TIM) for electronic packages. This innovative method involves providing a mixture of molten indium and molten aluminum. The process includes agitating the mixture while reducing its temperature until the aluminum transitions from a liquid phase to a solid phase, forming particles distributed within the molten indium. The agitation continues to maintain the aluminum particles suspended in the molten indium while further reducing the temperature until the indium solidifies. The resulting metallic composition includes indium and aluminum particles that are substantially free from oxidation. This solder composition can be utilized to form assemblies that include integrated circuit (IC) devices and thermal components, enhancing thermal coupling and performance.

Career Highlights

Fitzgerald is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has positioned him as a key player in the advancement of electronic packaging solutions.

Collaborations

Throughout his career, Fitzgerald has collaborated with notable colleagues, including Carl L Deppisch and Fay Hua. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Tom Fitzgerald's contributions to the field of electronics through his innovative patents and work at Intel Corporation highlight his importance as an inventor. His advancements in solder materials are paving the way for improved electronic assemblies and performance.