The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Mar. 20, 2006
Applicants:
Brian Murphy, Pfarrkirchen, DE;
Reinhold Wahlich, Tittmoning, DE;
Rüdiger Schmolke, Burghausen, DE;
Wilfried Von Ammon, Hochburg/Ach, AT;
James Moreland, Portland, OR (US);
Inventors:
Brian Murphy, Pfarrkirchen, DE;
Reinhold Wahlich, Tittmoning, DE;
Rüdiger Schmolke, Burghausen, DE;
Wilfried Von Ammon, Hochburg/Ach, AT;
James Moreland, Portland, OR (US);
Assignee:
Siltronic AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
SOI wafers are manufactured to have very thin device layers of high surface quality. The layer is ≦20 nm in thickness, has an HF density of ≦0.1/cm, and a surface roughness of 0.2 nm RMS.