The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Nov. 19, 2003
Patrick Y. Huet, San Jose, CA (US);
Robinson Piramuthu, San Jose, CA (US);
Martin Plihal, Pleasanton, CA (US);
Christopher W. Lee, San Ramon, CA (US);
Cho H. Teh, Cupertino, CA (US);
Yan Xiong, Sunnyvale, CA (US);
Patrick Y. Huet, San Jose, CA (US);
Robinson Piramuthu, San Jose, CA (US);
Martin Plihal, Pleasanton, CA (US);
Christopher W. Lee, San Ramon, CA (US);
Cho H. Teh, Cupertino, CA (US);
Yan Xiong, Sunnyvale, CA (US);
KLA-Tencor Corporation, San Jose, CA (US);
Abstract
A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.