The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Apr. 20, 2006
Zhen-long Chen, Dresden, DE;
Peter Weidner, Roetz, DE;
Pierre-yves Guittet, Taipei, TW;
Alexander Kasic, Dresden, DE;
Barbara Schmidt, Dresden, DE;
Anita Klee, Langebrueck, DE;
Zhen-Long Chen, Dresden, DE;
Peter Weidner, Roetz, DE;
Pierre-Yves Guittet, Taipei, TW;
Alexander Kasic, Dresden, DE;
Barbara Schmidt, Dresden, DE;
Anita Klee, Langebrueck, DE;
Infineon Technologies, AG, Neubiberg, DE;
Nanya Technology Corporation, , TW;
Abstract
An apparatus for monitoring a trench profile of a substrate includes a radiation-emitting unit for irradiating the substrate with infrared radiation. The intensity and/or polarization state of the infrared radiation reflected from the substrate is measured at a multitude of measuring frequencies. An analyzing unit determines the respective reflectance and relative phase change and/or relative amplitude change in relation to the respective measuring frequency. In addition, a reflectance spectrum, a relative phase change spectrum and/or a relative amplitude change spectrum may be obtained. By performing a Fourier transformation of the respective spectrum, a secondary Fourier spectrum is obtained. The secondary Fourier spectrum plots a virtual amplitude against corresponding values of a frequency periodicity that correspond to a substrate depth. Peaks of the virtual amplitude may indicate reflective planes within the substrate at respective depths. Thus, rough sections in the trench profile may be identified without modeling.