The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Apr. 22, 2005
Tetsuya Ishikawa, Saratoga, CA (US);
Rick J. Roberts, San Jose, CA (US);
Helen R. Armer, Cupertino, CA (US);
Leon Volfovski, Mountain View, CA (US);
Jay D. Pinson, San Jose, CA (US);
Michael Rice, Pleasanton, CA (US);
David H. Quach, San Jose, CA (US);
Mohsen S. Salek, Saratoga, CA (US);
Robert Lowrance, Los Gatos, CA (US);
John A. Backer, San Jose, CA (US);
William Tyler Weaver, Austin, TX (US);
Charles Carlson, Cedar Park, TX (US);
Chongyang Wang, San Jose, CA (US);
Jeffrey Hudgens, San Francisco, CA (US);
Harald Herchen, Los Altos, CA (US);
Brian Lue, Mountain View, CA (US);
Tetsuya Ishikawa, Saratoga, CA (US);
Rick J. Roberts, San Jose, CA (US);
Helen R. Armer, Cupertino, CA (US);
Leon Volfovski, Mountain View, CA (US);
Jay D. Pinson, San Jose, CA (US);
Michael Rice, Pleasanton, CA (US);
David H. Quach, San Jose, CA (US);
Mohsen S. Salek, Saratoga, CA (US);
Robert Lowrance, Los Gatos, CA (US);
John A. Backer, San Jose, CA (US);
William Tyler Weaver, Austin, TX (US);
Charles Carlson, Cedar Park, TX (US);
Chongyang Wang, San Jose, CA (US);
Jeffrey Hudgens, San Francisco, CA (US);
Harald Herchen, Los Altos, CA (US);
Brian Lue, Mountain View, CA (US);
Sokudo Co., Ltd., Kyoto, JP;
Abstract
A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.