The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2008

Filed:

May. 12, 2005
Applicants:

Gregory G. Freeman, Hopewell Junction, NY (US);

Anil K. Chinthakindi, Wappingers Falls, NY (US);

David R. Greenberg, White Plains, NY (US);

Basanth Jagannathan, Schaumburg, IL (US);

Marwan H. Khater, Poughkeepsie, NY (US);

John Pekarik, Underhill, VT (US);

Xudong Wang, Essex Junction, VT (US);

Inventors:

Gregory G. Freeman, Hopewell Junction, NY (US);

Anil K. Chinthakindi, Wappingers Falls, NY (US);

David R. Greenberg, White Plains, NY (US);

Basanth Jagannathan, Schaumburg, IL (US);

Marwan H. Khater, Poughkeepsie, NY (US);

John Pekarik, Underhill, VT (US);

Xudong Wang, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

A field effect transistor is provided which includes a contiguous single-crystal semiconductor region in which a source region, a channel region and a drain region are disposed. The channel region has an edge in common with the source region as a source edge, and the channel region further has an edge in common with the drain region as a drain edge. A gate conductor overlies the channel region. The field effect transistor further includes a structure which applies a stress at a first magnitude to only one of the source edge and the drain edge while applying the stress at no greater than a second magnitude to another one of the source edge and the drain edge, wherein the second magnitude has a value ranging from zero to about half the first magnitude. In a particular embodiment, the stress is applied at the first magnitude to the source edge while the zero or lower magnitude stress is applied to the drain edge. In another embodiment, the stress is applied at the first magnitude to the drain edge while the zero or lower magnitude stress is applied to the drain edge.


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