The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
May. 17, 2002
Sudhir Gondhalekar, Fremont, CA (US);
Tom K. Cho, Palo Alto, CA (US);
Rolf Guenther, Monte Sereno, CA (US);
Steve H. Kim, Union City, CA (US);
Mehrdad Moshfegh, San Jose, CA (US);
Shigeru Takehiro, Chiba, JP;
Thomas Kring, Sunnyvale, CA (US);
Tetsuya Ishikawa, Santa Clara, CA (US);
Sudhir Gondhalekar, Fremont, CA (US);
Tom K. Cho, Palo Alto, CA (US);
Rolf Guenther, Monte Sereno, CA (US);
Steve H. Kim, Union City, CA (US);
Mehrdad Moshfegh, San Jose, CA (US);
Shigeru Takehiro, Chiba, JP;
Thomas Kring, Sunnyvale, CA (US);
Tetsuya Ishikawa, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
The present invention is directed to an upper chamber design of a plasma CVD chamber which provides more uniform conditions for forming thin CVD films on a substrate. Embodiments of the invention improve temperature control of the upper chamber and improve particle performance by reducing or minimizing the temperature fluctuations on the dome between the deposition and non-deposition cycles. In accordance with an aspect of the present invention, an apparatus for processing semiconductor substrates comprises a chamber defining a plasma processing region therein. The chamber includes a bottom, a side wall, and a dome disposed on top of the side wall. The dome has a substantially flat dome top. A top RF coil is disposed above the dome top, and has an outer loop which is larger in size than the substrates to be processed in the chamber. A cold plate is disposed above the top RF coil, and is larger in size than the substrates to be processed in the chamber.