The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
May. 19, 2004
Shigemitsu Sato, Kanagawa, JP;
Masasuke Matsudai, Kanagawa, JP;
Hiroki Oozora, Kanagawa, JP;
Junya Kiyota, Kanagawa, JP;
Hajime Nakamura, Kanagawa, JP;
Satoru Ishibashi, Kanagawa, JP;
Atsushi Ota, Kanagawa, JP;
Shigemitsu Sato, Kanagawa, JP;
Masasuke Matsudai, Kanagawa, JP;
Hiroki Oozora, Kanagawa, JP;
Junya Kiyota, Kanagawa, JP;
Hajime Nakamura, Kanagawa, JP;
Satoru Ishibashi, Kanagawa, JP;
Atsushi Ota, Kanagawa, JP;
ULVAC, Inc., Chigasaki-shi, JP;
Abstract
According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of the substrate. During the sputtering, not only the targets but also magnetic field forming devices are moved relative to the targets, and therefore, a large area of the targets can be sputtered. In addition, when the magnetic field forming devices are also moved with respect to the substrate, the region of the target which is highly sputtered, moves with respect to the substrate, so that the thickness distribution of the film formed on the substrate can be even more uniform.