The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2008

Filed:

Jan. 03, 2006
Applicants:

Ta-chuan Yeh, Taipei, TW;

Ni-min Chung, Nan-Tou Hsien, TW;

Kao-su Huang, Tainan Hsien, TW;

Yung-chang Lin, Tai-chung Hsien, TW;

Ruey-chyr Lee, Tai-chung, TW;

Chien-kuo Wang, Tainan Hsien, TW;

Inventors:

Ta-Chuan Yeh, Taipei, TW;

Ni-Min Chung, Nan-Tou Hsien, TW;

Kao-Su Huang, Tainan Hsien, TW;

Yung-Chang Lin, Tai-chung Hsien, TW;

Ruey-Chyr Lee, Tai-chung, TW;

Chien-Kuo Wang, Tainan Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate is provided having an oxide layer, a first nitride-silicon, a STI, and a second nitride-silicon. A pattern poly-silicon layer on the second nitride-silicon layer is etched to form a deep trench opening. Etching the pattern poly-silicon layer also deepens the deep trench opening. Then, a conductive layer is filled in the deep trench opening.


Find Patent Forward Citations

Yeh, Ta-Chuan. (2008). Method of manufacturing a capacitor deep trench and of etching a deep trench opening (U.S. Patent No. 7344954). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7344954

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…