The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2008

Filed:

Oct. 02, 2003
Applicants:

Chishio Koshimizu, Yamanashi, JP;

Hiroyuki Ishihara, Yamanashi, JP;

Kimihiro Higuchi, Yamanashi, JP;

Koji Maruyama, Nirasaki, JP;

Inventors:

Chishio Koshimizu, Yamanashi, JP;

Hiroyuki Ishihara, Yamanashi, JP;

Kimihiro Higuchi, Yamanashi, JP;

Koji Maruyama, Nirasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); C23C 16/00 (2006.01); C23C 14/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrostatic chuckis provided on a lower electrodeprovided inside a processing chamberof an etching apparatusand a conductive inner ring bodyand an insulating outer ring bodyare encompassing the outer edges of a wafer W mounted on the chuck surface. The temperatures of the wafer W and the inner and outer ring bodiesandare detected by first˜third temperature sensorsandA controllercontrols the pressure levels of He supplied to the space between the center of the wafer W and the electrostatic chuckvia first gas outlet ductsand to the space between the outer edges of the wafer W and the electrostatic chuckvia second gas outlet ductsand the quantity of heat generated by a heaterinside the outer ring bodybased upon the information on the temperatures thus detected so that the temperatures of the wafer W and the inner ring bodyare set roughly equal to each other.


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