The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2008
Filed:
Jan. 12, 2004
Warren M. Farnworth, Nampa, ID (US);
Steven M. Mcdonald, Star, ID (US);
Nishant Sinha, Boise, ID (US);
William M. Hiatt, Eagle, ID (US);
Warren M. Farnworth, Nampa, ID (US);
Steven M. McDonald, Star, ID (US);
Nishant Sinha, Boise, ID (US);
William M. Hiatt, Eagle, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by masking and etching. Additional layers of conductive materials may be used to provide a barrier layer and a noble metal cap for the conductive elements. The methods of the present invention may be used to fabricate an interposer for use in packaging semiconductor devices or a test substrate. Substrate precursor structures are also disclosed.