The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Aug. 30, 2004
Nagarajan Rajagopalan, Santa Clara, CA (US);
Meiyee Shek, Mountain View, CA (US);
Albert Lee, Cupertino, CA (US);
Annamalai Lakshmanan, Santa Clara, CA (US);
Li-qun Xia, Santa Clara, CA (US);
Zhenjiang Cui, San Jose, CA (US);
Nagarajan Rajagopalan, Santa Clara, CA (US);
Meiyee Shek, Mountain View, CA (US);
Albert Lee, Cupertino, CA (US);
Annamalai Lakshmanan, Santa Clara, CA (US);
Li-Qun Xia, Santa Clara, CA (US);
Zhenjiang Cui, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Methods are provided for processing a substrate for depositing an adhesion layer between a conductive material and a dielectric layer. In one aspect, the invention provides a method for processing a substrate including positioning a substrate having a conductive material disposed thereon, introducing a reducing compound or a silicon based compound, exposing the conductive material to the reducing compound or the silicon based compound, and depositing a silicon carbide layer without breaking vacuum.