The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2007
Filed:
Mar. 03, 2004
Grace H. Ho, Tainan, TW;
Ming-che Wu, Chia-Yi, TW;
Li-heng Chou, Kaohsiung, TW;
Hung-chang Hsieh, Hsinchu, TW;
Jung Ting Chen, Tao Yuan, TW;
Yao-ching Ku, Hsin-Chu, TW;
Grace H. Ho, Tainan, TW;
Ming-Che Wu, Chia-Yi, TW;
Li-Heng Chou, Kaohsiung, TW;
Hung-Chang Hsieh, Hsinchu, TW;
Jung Ting Chen, Tao Yuan, TW;
Yao-Ching Ku, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company Ltd., Hsin-Chu, TW;
Abstract
A semiconductor wafer is disclosed that includes a plurality of fields, including a plurality of alignment fields. Each alignment field includes a plurality of intra-field small scribe lane primary mark (SSPM) overlay mark pairs there around. The SSPM mark pairs allow for in-situ, non-passive intra-field alignment correction. In one embodiment, there may be between two and four alignment fields, and between two and four SSPM mark pairs around each alignment field. The SSPM marks of each mark pair may be extra scribe-lane marks.