The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2006

Filed:

Mar. 15, 2005
Applicants:

David Soltz, San Jose, CA (US);

Mehran Nasser-ghodsi, Hamilton, MA (US);

Harold Winters, San Jose, CA (US);

John W. Coburn, San Jose, CA (US);

Alexander Gubbens, Redwood City, CA (US);

Gabor Toth, San Jose, CA (US);

Inventors:

David Soltz, San Jose, CA (US);

Mehran Nasser-Ghodsi, Hamilton, MA (US);

Harold Winters, San Jose, CA (US);

John W. Coburn, San Jose, CA (US);

Alexander Gubbens, Redwood City, CA (US);

Gabor Toth, San Jose, CA (US);

Assignee:

KLA-Tencor Technologies Corp., Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and systems for preparing a substrate for analysis are provided. One method includes removing a portion of a copper structure on the substrate using an etch chemistry in combination with an electron beam. The etch chemistry is substantially inert with respect to the copper structure except in the presence of the electron beam. Other methods involve forming masking layers on a substrate that will protect the substrate during etching. For example, one method includes exposing a first portion of the substrate to an electron beam. A second portion of the substrate not exposed to the electron beam includes a copper structure. The method also includes exposing the substrate to a fluorine containing chemical. The fluorine containing chemical bonds to the first portion but not the second portion to form a fluorine containing layer on the first portion.


Find Patent Forward Citations

Loading…