The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Nov. 12, 2004
Chao-yuan Su, Koahsiung, TW;
Chen-der Huang, Hsin-Chu, TW;
Pei-haw Tsao, Tai-Chung, TW;
Chuen-jye Lin, Taichung, TW;
Chao-Yuan Su, Koahsiung, TW;
Chen-Der Huang, Hsin-Chu, TW;
Pei-Haw Tsao, Tai-Chung, TW;
Chuen-Jye Lin, Taichung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A substrate design to improve chip package reliability is provided. The chip package includes a substrate having a ceramic layer formed in a recess. A die is attached to the substrate on the ceramic layer. The substrate may be attached to a printed circuit board. The substrate may be fabricated by forming a recess in a substrate, such as a multi-layer substrate formed of organic dielectric materials. A ceramic layer is then affixed to the substrate in the recess. A die may be attached to the ceramic layer and the substrate may be attached to a printed circuit board.