The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7102737 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 05, 2006

Filed:

Jun. 04, 2004
Applicants:

Mark Eyolfson, Boise, ID (US);

Elton J. Hochhalter, Boise, ID (US);

Joe Lee Phillips, Nampa, ID (US);

David R. Johnson, Meridian, ID (US);

Peter S. Frank, Boise, ID (US);

Inventors:

Mark Eyolfson, Boise, ID (US);

Elton J. Hochhalter, Boise, ID (US);

Joe Lee Phillips, Nampa, ID (US);

David R. Johnson, Meridian, ID (US);

Peter S. Frank, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/64 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus for detection of a particular material, such as photo-resist material, on a sample surface are disclosed. A narrow beam of light is projected onto the sample surface and the fluoresced and/or reflected light intensity at a particular wavelength band is measured by a light detector. The light intensity is converted to a numerical value and transmitted electronically to a logic circuit, which determines the proper disposition of the sample. The logic circuit controls a sample-handling robotic device which sequentially transfers samples to and from a stage for testing and subsequent disposition. The method is particularly useful for detecting photo-resist material on the surface of a semiconductor wafer.


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