The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2006

Filed:

Oct. 03, 2000
Applicants:

Ming Xi, Milpitas, CA (US);

Ashok Sinha, Palo Alto, CA (US);

Moris Kori, Palo Alto, CA (US);

Alfred W. Mak, Union City, CA (US);

Xinliang LU, Union City, CA (US);

Ken Kaung Lai, Milpitas, CA (US);

Karl A. Littau, Palo Alto, CA (US);

Inventors:

Ming Xi, Milpitas, CA (US);

Ashok Sinha, Palo Alto, CA (US);

Moris Kori, Palo Alto, CA (US);

Alfred W. Mak, Union City, CA (US);

Xinliang Lu, Union City, CA (US);

Ken Kaung Lai, Milpitas, CA (US);

Karl A. Littau, Palo Alto, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and system to form a refractory metal layer on a substrate features nucleating a substrate using sequential deposition techniques in which the substrate is serially exposed to first and second reactive gases followed by forming a layer, employing vapor deposition, to subject the nucleation layer to a bulk deposition of a compound contained in one of the first and second reactive gases.


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