The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Oct. 28, 2003
Norio Kimura, Fujisawa, JP;
Mitsuhiko Shirakashi, Fujisawa, JP;
Katsuhiko Tokushige, Sagamihara, JP;
Masao Asami, Kawasaki, JP;
Naoto Miyashita, Yokohama, JP;
Masako Kodera, Yokohama, JP;
Yoshitaka Matsui, Yokohama, JP;
Soichi Nadahara, Yokohama, JP;
Hiroshi Tomita, Yokohama, JP;
Norio Kimura, Fujisawa, JP;
Mitsuhiko Shirakashi, Fujisawa, JP;
Katsuhiko Tokushige, Sagamihara, JP;
Masao Asami, Kawasaki, JP;
Naoto Miyashita, Yokohama, JP;
Masako Kodera, Yokohama, JP;
Yoshitaka Matsui, Yokohama, JP;
Soichi Nadahara, Yokohama, JP;
Hiroshi Tomita, Yokohama, JP;
Ebara Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Kanagawa-Ken, JP;
Abstract
A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.