The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Apr. 16, 2004
Joseph F. Salfelder, Pleasant Valley, NY (US);
Wayne Swart, Tivoli, NY (US);
Gopalakrishna B. Prabhu, San Jose, CA (US);
Srinivas R. Mirmira, San Jose, CA (US);
Laertis Economikos, Wappingers Falls, NY (US);
Fen Fen Jamin, Wappingers Falls, NY (US);
Donald J. Delehanty, Wappingers Falls, NY (US);
Daniel Heenan, North East, MD (US);
Joseph M. Danza, Newburgh, NY (US);
Joseph F. Salfelder, Pleasant Valley, NY (US);
Wayne Swart, Tivoli, NY (US);
Gopalakrishna B. Prabhu, San Jose, CA (US);
Srinivas R. Mirmira, San Jose, CA (US);
Laertis Economikos, Wappingers Falls, NY (US);
Fen Fen Jamin, Wappingers Falls, NY (US);
Donald J. Delehanty, Wappingers Falls, NY (US);
Daniel Heenan, North East, MD (US);
Joseph M. Danza, Newburgh, NY (US);
Applied Materials, Santa Clara, CA (US);
International Business Machine Corporation, Armonk, NY (US);
Abstract
A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.