The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Jul. 02, 2004
Kazuhito Uchikura, Chuo-ku, JP;
Kazuo Nishimoto, Chuo-ku, JP;
Masayuki Hattori, Chuo-ku, JP;
Nobuo Kawahashi, Chuo-ku, JP;
Hiroyuki Yano, Yokohama, JP;
Yukiteru Matsui, Yokohama, JP;
Gaku Minamihaba, Yokohama, JP;
Dai Fukushima, Kamakura, JP;
Nobuyuki Kurashima, Yokohama, JP;
Kazuhito Uchikura, Chuo-ku, JP;
Kazuo Nishimoto, Chuo-ku, JP;
Masayuki Hattori, Chuo-ku, JP;
Nobuo Kawahashi, Chuo-ku, JP;
Hiroyuki Yano, Yokohama, JP;
Yukiteru Matsui, Yokohama, JP;
Gaku Minamihaba, Yokohama, JP;
Dai Fukushima, Kamakura, JP;
Nobuyuki Kurashima, Yokohama, JP;
JSR Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A chemical mechanical polishing aqueous dispersion comprises a component (A) composed of abrasive grains, a component (B) composed of at least one of quinolinecarboxylic acid and pyridinecarboxylic acid, a component (C) composed of an organic acid other than quinolinecarboxylic acid and pyridinecarboxylic acid and a component (D) composed of an oxidizing agent, wherein a mass ratio (WB/WC) of the content (WB) of the component (B) to the content (WC) of the component (C) is not less than 0.01 and less than 2, and the concentration of an ammonia component composed of ammonia and ammonium ion is not more than 0.005 mol/litter. According to the chemical mechanical polishing aqueous dispersion, various layers to be processed can be polished with high efficiency, and a sufficiently planarized polished surface of high precision can be obtained.