The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Aug. 29, 2003
Suan Jeung Boon, Singapore, SG;
Yong Poo Chia, Singapore, SG;
Min Yu Chan, Singapore, SG;
Meow Koon Eng, Singapore, SG;
Siu Waf Low, Singapore, SG;
Swee Kwang Chua, Singapore, SG;
Suan Jeung Boon, Singapore, SG;
Yong Poo Chia, Singapore, SG;
Min Yu Chan, Singapore, SG;
Meow Koon Eng, Singapore, SG;
Siu Waf Low, Singapore, SG;
Swee Kwang Chua, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Packaged microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, the device includes an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side. The device further includes a window at the first side of the image sensor die and a lead mounted to the second side of the image sensor die. The window is radiation transmissive and positioned over the active area of the image sensor die. The lead is electrically coupled to the bond-pad on the image sensor die.