The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Jan. 29, 2003
Shumin Wang, Naperville, IL (US);
Vlasta Brusic Kaufman, Geneva, IL (US);
Steven K. Grumbine, Aurora, IL (US);
Isaac K. Cherian, Aurora, IL (US);
Shumin Wang, Naperville, IL (US);
Vlasta Brusic Kaufman, Geneva, IL (US);
Steven K. Grumbine, Aurora, IL (US);
Isaac K. Cherian, Aurora, IL (US);
Cabot Microelectronics Corporation, Aurora, IL (US);
Abstract
The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, wherein the stopping compound is a cationically charged nitrogen containing compound selected from compounds comprising amines, imines, amides, imides, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.