The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Dec. 11, 2003
Applicants:
T. Todd Crkvenac, Hockessin, DE (US);
Jeffrey J. Hendron, Elkton, MD (US);
Gregory P. Muldowney, Glen Mills, PA (US);
Inventors:
T. Todd Crkvenac, Hockessin, DE (US);
Jeffrey J. Hendron, Elkton, MD (US);
Gregory P. Muldowney, Glen Mills, PA (US);
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 100 ;
U.S. Cl.
CPC ...
Abstract
A method of polishing a surface () of an article, e.g., a semiconductor wafer (), using a polishing layer () in the presence of a polishing medium, such as a slurry (). The method includes selecting the rotational rate of the article or the velocity of the polishing layer, or both, so as to control either removal rate uniformity or the occurrence of defects on the polished surface, or both.