The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2004

Filed:

Jun. 03, 2003
Applicant:
Inventors:

Hirokazu Sayama, Tokyo, JP;

Kazunobu Ohta, Tokyo, JP;

Hidekazu Oda, Tokyo, JP;

Kouhei Sugihara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1336 ;
U.S. Cl.
CPC ...
H01L 2/1336 ;
Abstract

A method of manufacturing a semiconductor device includes forming a gate insulating film on a semiconductor substrate, forming a polysilicon layer on the gate insulating film, implanting ions into the polysilicon layer, patterning the polysilicon layer to form a gate electrode, annealing the gate electrode, and siliciding an upper portion of the gate electrode to form a silicide layer that has a lower portion facing the gate electrode and an upper portion opposite to the lower portion, the upper portion of the silicide layer being wider than the lower portion. A total dose of ions implanted during the step of implanting is 6×10 /cm or larger.


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