The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2004

Filed:

May. 22, 2002
Applicant:
Inventors:

Steven T. Mayer, Lake Oswego, OR (US);

Evan E. Patton, Portland, OR (US);

Brian Paul Blackman, Woodburn, OR (US);

Jonathan D. Reid, Sherwood, OR (US);

Thomas Anand Ponnuswamy, Tualatin, OR (US);

Harold D. Perry, Eugene, OR (US);

Assignee:

Novellus Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/00 ; C25B 9/00 ;
U.S. Cl.
CPC ...
C25D 5/00 ; C25B 9/00 ;
Abstract

The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating cell is distributed among a plurality of anodes in the plating cell in order to tailor the current distribution in the plating electrolyte to compensate for resistance and voltage variation across a work piece due to the seed layer. Focusing elements are used to create “virtual anodes” in proximity to the plating surface of the work piece to further control the current distribution in the electrolyte during plating.


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