This inventor holds 1 USPTO granted patent. Top assignee: Novellus Systems Incorporated. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Harold D. Perry: Inventor in Electroplating Technology
Introduction
Harold D. Perry is an inventor associated with Eugene, Oregon, and Novellus Systems Incorporated. His patent work addresses the challenge of depositing a uniform metal layer onto thin, metal-seeded wafers.
Latest Patents
Perry is credited with 1 patent: “Method and Apparatus for Uniform Electroplating of Thin Metal Seeded Wafers Using Multiple Segmented Virtual Anode Sources.” The invention distributes a plating cell’s total current among multiple anodes to compensate for resistance and voltage variations across a workpiece. Focusing elements create “virtual anodes” near the plating surface, providing additional control over current distribution and helping produce a substantially uniform metal layer.
Career Highlights
Perry’s listed patent reflects work on electroplating methods and equipment for semiconductor wafer processing. The invention combines segmented anode sources with focusing elements to address uneven current distribution associated with a wafer’s seed layer.
Collaborations
Perry’s listed coworkers include Jonathan David Reid and Thomas Anand Ponnuswamy. The available information identifies these professional associations but does not specify their roles in the patent.
Conclusion
Harold D. Perry’s patent focuses on improving the uniformity of electroplated metal layers through controlled current distribution and virtual anode sources.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile