The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
May. 12, 2000
Thomas E Barta, Evanston, IL (US);
Daniel P Becker, Glenview, IL (US);
Louis J Bedell, Mt. Prospect, IL (US);
Terri L Boehm, Ballwin, MO (US);
Jeffrey N Carroll, Collinsville, IL (US);
Gary A DeCrescenzo, St. Charles, MO (US);
Yvette M Fobian, Wildwood, MO (US);
John N Freskos, Clayton, MO (US);
Daniel P Getman, Chesterfield, MO (US);
Joseph J McDonald, Ballwin, MO (US);
Madeleine H Li, Vernon Hills, IL (US);
Susan L Hockerman, Lincolnwood, IL (US);
Susan C Howard, Fenton, MO (US);
Steve A Kolodziej, Ballwin, MO (US);
Deborah A Mischke, Defiance, MO (US);
Joseph G Rico, Ballwin, MO (US);
Nathan W Stehle, Ballwin, MO (US);
Michael B Tollefson, Hainesville, IL (US);
William F Vernier, St. Louis, MO (US);
Clara I Villamil, Glenview, IL (US);
Pharmacia Corporation, St. Louis, MO (US);
Abstract
A treatment process is disclosed that comprises administering an effective amount of an aromatic sulfone hydroxamic acid that exhibits excellent inhibitory activity of one or more matrix metalloprotease (MMP) enzymes, such as MMP-2, MMP-9 and MMP-13, while exhibiting substantially less inhibition at least of MMP-1 to a host having a condition associated with pathological matrix metalloprotease activity. Also disclosed are metalloprotease inhibitor compounds having those selective activities, processes for manufacture of such compounds and pharmaceutical compositions using an inhibitor. A contemplated compound corresponds in structure to formula B, below,