The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
May. 17, 2002
Applicant:
Inventors:
Chung Yu Wang, Jung he, TW;
Chender Huang, Hsinchu, TW;
Pei-Haw Tsao, Nan chiu, TW;
Ken Chen, Hsinchu, TW;
Hank Huang, Jungli, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Hsin-chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A01L 2/144 ;
U.S. Cl.
CPC ...
A01L 2/144 ;
Abstract
An under bump metallurgy (UBM) structure is described. Two UBM mask processes are utilized. First, a top layer of copper (Cu) and/or a middle layer of nickel-vanadium (NiV) or chrome-copper (CrCu) is personalized by standard photoprocessing and etching steps utilizing a bump based size mask. This is followed by patterning an underlying seed layer with a second, larger mask, thereby preventing damage to the aluminum cap and seed layer undercut during the etching process.